Please note: This workshop is by invitation only. Invited guests should register via the button to the left to confirm your attendance by April 1, 2022.
The Ohio State University, through the Office of Knowledge Enterprise, in partnership with many of the Midwest’s leading research universities, will come together to: assess regional needs and opportunities to support the expansion of the semiconductor industry in the Midwest; and explore approaches to form a regional network to pursue anticipated federal funding to support semiconductor workforce development and research/domestic supply chain development activities. Registration is needed to confirm and assign participants into working groups.
The five topics covered as part of facilitated breakout sessions will include:
- Workforce and Manufacturing
- Research and Innovation: Packaging/Integration
- Research and Innovation: Circuits/Architecture
- Research and Innovation: Devices
- Infrastructure for Experiential Learning
Agenda (see detailed agenda here)
11 a.m.
Registration Opens
12 – 12:45 p.m.
Working Lunch
1 – 2 p.m.
Opening Framing Discussion
2:15 – 3:45 p.m.
Facilitated Breakout Session 1
4 – 5:30 p.m.
Facilitated Breakout Session 2
8 a.m.
Registration Opens & Breakfast
9 – 10:30 a.m.
Facilitated Breakout Session 3
10:45 a.m. – 12: 15 p.m.
Closing Session
Questions?
Please contact Dr. Dorota Grejner-Brzezinska, Vice President for Knowledge Enterprise at grejner-brzezinska.1@osu.edu; Laurie Neer, Operations Specialist, at neer.57@osu.edu; or your university representative.
Hotels, Meals, and Parking
Please choose and book your preferred hotel accommodations. Ohio State will provide lunch and post-workshop hors d'oeuvres on April 6 and breakfast and boxed-lunches to go on April 7. Parking is free at the venue (must print and display parking pass emailed to you).
Hotel Suggestions:
Workshop Steering Committee
- Dr. Dorota Grejner-Brzezinksa, Chair - The Ohio State University
- Dr. James-McGuffin-Cawley - Case Western Reserve University
- Dr. Thomas Glasmacher - Michigan State University
- Drs. Arvind Raman and Ashraf Alam - Purdue University
- Dr. Rashmi Jha - University of Cincinnati
- Dr. David Ashley - University of Dayton
- Dr. Eric Michielssen - University of Michigan
- Dr. Alan Seabaugh - University of Notre Dame
Technical Committee Working Groups
Workforce and Manufacturing
- Dr. John Verboncoeur (Group Lead) - Michigan State University
- Dr. Muhammad Hussain - Purdue University
- Dr. Andrew Sarangan - University of Dayton
Research and Innovation: Packaging/Integration
- Dr. Nik Chawla (Group Lead) - Purdue University
- Dr. John Papapolymerou - Michigan State University
- Dr. Christian Zorman - Case Western Reserve University
Research and Innovation: Circuits/Architecture
- Dr. Ayman Fayed (Group Lead) - The Ohio State University
- Dr. Vamsy Chodavarap - University of Dayton
- Dr. Dennis Sylvester - University of Michigan
- Dr. Michael Niemier - University of Notre Dame
Research and Innovation: Devices
- Dr. Patrick Fay (Group Lead) - University of Notre Dame
- Dr. Xuan Gao - Case Western Reserve University
- Dr. Rashmi Jha - University of Cincinnati
Infrastructure for Experiential Learning
- Dr. Becky Peterson (Group Lead) - University of Michigan
- Dr. Gigi Escoe - University of Cincinnati
- Dr. Paul Berger - The Ohio State University
